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  • Aluminum Base CCL
  • Aluminum Base CCL

Aluminum Base CCL

Metal core copper clad laminate for applications requiring stronger heat dissipation, board stability and thermal management support.
  • Aluminum Base CCL

Description

Aluminum Base CCL

Metal core copper clad laminate for applications requiring stronger heat dissipation, board stability and thermal management support.

Product Description

Aluminum base copper clad laminate is used where heat management is part of the product requirement, not just electrical connection. It is especially suitable for overseas buyers in LED, power conversion and industrial electronics who need a thermally efficient PCB base material.

Basic Parameters

Material StructureCopper foil plus dielectric layer on aluminum base
Key FeaturesHeat dissipation support, board rigidity and electrical insulation design
Product FocusThermal-management PCB applications
Supply StatusCustomizable

Product Specifications

  • Specification status: Customizable
  • Board structure and size can be supplied according to thermal management application needs
  • Available for project-based export supply in LED and power electronics fields

Application Scenarios

  • LED lighting boards and thermal-management electronic modules
  • Power electronics, converters and industrial driver systems
  • Projects requiring heat spreading performance beyond standard rigid PCB materials
  • Customers needing a reliable export supply option for metal core board applications